Analysis of the Failure of FSBB30CH60C When Exposed to Electrostatic Discharge (ESD)
The FSBB30CH60C is a silicon carbide (SiC) MOSFET commonly used in high-power applications. However, like many other semiconductor devices, it can fail when exposed to Electrostatic Discharge (ESD). In this analysis, we will discuss why this failure happens, the potential causes, and how to address such failures effectively.
Why the FSBB30CH60C Fails When Exposed to ESD
Sensitive Nature of MOSFETs : The FSBB30CH60C, being a MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor), is sensitive to voltage spikes. Electrostatic Discharge (ESD) can create a sudden surge of voltage that exceeds the voltage tolerance of the MOSFET, leading to breakdowns of its internal components.
Gate Oxide Breakdown: The gate oxide layer is particularly vulnerable to high-voltage spikes caused by ESD. If the ESD exceeds the gate oxide's maximum voltage rating, it can cause the oxide layer to break down, damaging the gate terminal. This damages the MOSFET’s ability to properly control the flow of current and leads to failure.
Overvoltage Stress: Even if the MOSFET is not directly touched, nearby electrical discharges can induce high voltages within the device. This can result in excessive stress on the device's junctions and lead to catastrophic failure if the stress exceeds the device’s maximum ratings.
Internal Short Circuits: When the ESD voltage is high enough, it can lead to internal short circuits within the MOSFET, which can permanently damage the device. The failure might appear as a short circuit between the drain, gate, and source terminals.
Causes of ESD Failure
Improper Handling: One of the most common causes of ESD damage to components like the FSBB30CH60C is improper handling during assembly, testing, or installation. This includes not using proper ESD protection methods, such as grounding or antistatic wrist straps.
Lack of ESD Protection Components: The absence of ESD protection components, such as TVS (Transient Voltage Suppression) diodes, Zener diodes, or other protective circuits, increases the risk of damage from electrostatic discharge.
Environmental Factors: Dry environments, where static electricity can build up more easily, can make devices more susceptible to ESD. Workstations or storage areas without proper humidity control can exacerbate this problem.
How to Solve and Prevent ESD Failures
Use Proper ESD Handling Techniques: Always wear an antistatic wrist strap when handling MOSFETs like the FSBB30CH60C. Use antistatic mats on workbenches. Ensure that all personnel in the area are trained on ESD safety and handling procedures. Store components in ESD-safe bags or containers when not in use. Integrate ESD Protection Devices: Place a TVS diode or Zener diode in parallel with the MOSFET to protect it from voltage spikes. Use ESD suppressors in sensitive areas of the circuit to absorb high-voltage surges before they reach the MOSFET. Design Circuit with ESD Mitigation: Ensure that the MOSFET is not exposed to unprotected nodes or circuits where high voltage spikes can occur. Integrate ESD protection on PCB traces by using proper grounding and placing protection components close to vulnerable areas of the circuit. Ensure that decoupling capacitor s are used in high-speed circuits to smooth out transient voltages. Controlled Environment: Control the environmental conditions around the component. Keep the humidity level within a recommended range to minimize the buildup of static charges. Consider using ionizing air blowers or humidifiers in the work environment to reduce static buildup. Test ESD Resilience: Conduct thorough ESD testing on the design and the FSBB30CH60C device before deployment to ensure it can handle the expected levels of electrostatic discharge.Conclusion
The FSBB30CH60C, like other sensitive components, can fail when exposed to ESD due to its internal structures being vulnerable to high-voltage surges. By understanding the causes of ESD failure and implementing proper handling, protective measures, and environmental controls, the risk of failure can be significantly reduced. Always ensure that ESD protection is part of the design and handling process to prolong the life of your components and ensure reliability in your high-power applications.
